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IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

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IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

Name: IRLML5203TRPBF IC Chip PChannel 30 V 3A 125W Surface Mount Micro3 SOT23
Brand: Original
Price: 1 USD

Brand Name : Original

Model Number : IRLML5203TRPBF

Certification : Original

Place of Origin : Original

MOQ : 1

Price : negotiation

Payment Terms : T/T

Supply Ability : 100,000

Delivery Time : 1-3working days

Packaging Details : carton box

FET Type : P-Channel

Drain to Source Voltage (Vdss) : 30 V

Current - Continuous Drain (Id) @ 25°C : 3A (Ta)

Rds On (Max) @ Id, Vgs : 98mOhm @ 3A, 10V

Vgs(th) (Max) @ Id : 2.5V @ 250µA

Gate Charge (Qg) (Max) @ Vgs : 14 nC @ 10 V

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IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

Features of IRLML5203TRPBF

Ultra Low On-Resistance
P-Channel MOSFET
Surface Mount
Available in Tape & Reel
Low Gate Charge
Lead-Free
RoHS Compliant, Halogen-Free

Product Attributes of IRLML5203TRPBF

Product	IRLML5203TRPBF
FET Type	P-Channel
Technology	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	30 V
Current - Continuous Drain (Id) @ 25°C	3A (Ta)
Drive Voltage (Max Rds On, Min Rds On)	4.5V, 10V
Rds On (Max) @ Id, Vgs	98mOhm @ 3A, 10V
Vgs(th) (Max) @ Id	2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs	14 nC @ 10 V
Vgs (Max)	±20V
Input Capacitance (Ciss) (Max) @ Vds	510 pF @ 25 V
FET Feature	-
Power Dissipation (Max)	1.25W (Ta)
Operating Temperature	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount
Supplier Device Package	Micro3™/SOT-23
Package / Case	TO-236-3, SC-59, SOT-23-3
Base Product Number	IRLML5203

Environmental & Export Classifications of IRLML5203TRPBF

ATTRIBUTE	DESCRIPTION
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8541.29.0095

Description of IRLML5203TRPBF

These P-channel MOSFETs from International Rectifier utilize
advanced processing techniques to achieve the extremely low
on-resistance per silicon area. This benefit provides the
designer with an extremely efficient device for use in battery
and load management applications.
A thermally enhanced large pad leadframe has been
incorporated into the standard SOT-23 package to produce a
HEXFET Power MOSFET with the industry's smallest footprint.
This package, dubbed the Micro3TM, is ideal for applications
where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro3 allows it to fit easily into
extremely thin application environments such as portable
electronics and PCMCIA cards. The thermal resistance and
power dissipation are the best available.

IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

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IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23 Images

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IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23

IRLML5203TRPBF IC Chip

P Channel IRLML5203TRPBF

3A 1.25W Surface Mount Circuit Chip

IRLML5203TRPBF IC Chip P-Channel 30 V 3A 1.25W Surface Mount Micro3™ / SOT-23 Images